Hengfeng New Materials secured tens of millions of yuan in Pre-B round financing to accelerate the localization of core materials for semiconductor packaging
2025/09/13
Shanghai Hengfeng New Material Technology Co., Ltd. (hereinafter referred to as "Hengfeng New Material") recently completed a Pre-B round of financing worth tens of millions of yuan. This round of financing was led by Yida Capital, with Lingang Digital Technology Fund and Shangyan ShenGong Fund following suit, and existing shareholder Yaotu Capital continuing to invest. Shijing Capital served as the exclusive financial investment advisor. The cumulative amount from the two rounds of financing has exceeded 100 million yuan, which will aid in upgrading the company's product supply system and strategic layout in the electronic-grade specialty phenolic resin and specialty phenolic epoxy resin markets.