Biphenyl phenolic resin

简介概述

It is a special high-purity biphenyl phenol resin with high flame retardancy, low water absorption, good toughness, and good chemical resistance. Suitable for electronic grade epoxy sealing materials, high-speed copper-clad laminates, and other applications.

详细参数

Grade	Viscosity P/150°C	Softening point °C	Hydroxyl equivalent g/eq	Feature
ResiCareâ3900	0.4-0.9	64-74	201-208	Ultra low water absorption, high toughness, chemical resistance, heat resistance
ResiCareâ3900L	0.9-1.5	72-79	208-212
ResiCareâ3900H	2.5-4.5	78-88	212-220

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