Novolac

简介概述

Used in a series of epoxy curing systems such as electronic grade epoxy molding compounds and copper-clad laminates, the product has strong applicability, high stability, and stable thermal rheological properties, and is suitable for single component or multi-component epoxy curing systems.

详细参数

Grade	Softening point °C	Free phenol %	Feature
ResiCareâ3020	94-100	<0.1
ResiCareâ3108	104-109	<0.1	Linear phenolic aldehyde, universal FR4 curing agent
ResiCareâ3120	113-118	<0.1	Linear phenolic aldehyde, universal FR4 curing agent

Grade

Solid content

Free phenol

Feature

ResiCareâ3165S

63-67

<0.1

Solvent based electronic phenolic resin

ResiCareâ3166S

63-67

<0.1

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